#chipLatest updates

Why Intel is stacking AI chips vertically in 2026

Dariusz Wieczorek

PRO
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17 days ago

Article
Technology
Tech Gadgets

Why Intel is stacking AI chips vertically in 2026

Intel is using through-silicon vias and Foveros Direct 3D bonding to stack AI chips vertically, cutting latency and power draw as planar scaling hits limits.

ASML dominates Q1 2026 as the sole provider of euv technology

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3 months ago

News
Business
Corporations

ASML dominates Q1 2026 as the sole provider of euv technology

High-performance computing and AI workloads depend on ASML’s exclusive EUV technology. The Q1 2026 report proves no competitors exist for critical chip tools.

Japan invests 4 billion in Rapidus for chip independence

Jennifer Walston

PRO
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4 months ago

News
Business
Trade & Supply Chains

Japan invests $4 billion in Rapidus for chip independence

Japan allocates $4 billion to Rapidus for 2nm chip production at the IIM-1 facility. This strategic move aims to secure national semiconductor self-sufficiency.